●蓝膜→蓝膜；tray·wafer;一分为多
●12 “8" &tray→8 "6" 4
●产品厚度≧65μ m；die size≧500μm
●wafer X,Y axis ± 2mil tolerance
●input 12"~3",output 2~4 " tray or 6&8 " wafer;
●ink&map单一产品以及MPW圆片、MTK圆片、huttle
●产品厚度≧65μ m,die size≧500um
●每月产能15kk颗
●Tray: X,Y axis: die size + 5mil with
± 1mil tolerance; Z axis: die thickness +
4mil with ± 2mil tolerance;
●wafer X,Y axis ± 2mil tolerance
