●12“~2”硅圆片、MPW/MTK圆片、Block
●激光划片槽宽度≥20μm
●刀片划片划槽宽度≥50μm
●芯片/基板厚度：≤1.0mm
●12"、8"、6",5"、4"、2"
●裸die、Block、MPW圆片减薄
●8&12 “≥200 u m(LCD drivergoldbump)
●8&12 “≥50μ m(no bump)
●8&12“≥150u m(sold bump)
●6/5/4/3”≥100μm；【工程能力】≥60μm
◆建议Polish要求
●no bump <150 μ m;
●bump(gold bump &sold bump) <250 u m
